13 August 2003: The reset redundancy scheme has been updated with the advised addition of a LVDSBUF to regenerate the  CMOS signaling.

23 April 2003: Two new documents available in the RX40 web site: one overview on the "production test" procedure, the other reporting the BER measurements on the packaged RX40_V1_2 chip.

March-April 2003: RX40_V1_2 packaged chips produced within the TrackerService reticle are screened for failing chips (production testing procedure)

December 2002: 48 wafers of TrackerService are delivered after the first production run. RX40 chips are sent for packaging.

June 2002: Wafers with the TrackerService design delivered from the Foundry after the engineering run. This reticle includes the final version of the RX40 chip, RX40_V1_2.

October 2001: 150 chips RX40_V1_1 sent for packaging in LPCC32

9 October 2001: Web page created

Last modified: 13 August 2003